Printed circuit board assembly is our specialty. HENGKAITUO has the best equipment, the most experience, and the broadest PCB assembly capabilities in the industry.
Through hole assembly is performed automatically by independent axial and radial Universal machines. Surface mount is handled by our YAMAHA and Siemens placement machines. Whichever technology your PCB requires our PCB assembly equipment delivers accurate repeatable results time after time.
Pick-and-place machinery by SIEMENS enables HKT to place more than 100,000 components per hour on a single manufacturing line, including increasingly small and dense package sizes as demanded by today’s marketplace. The SIEMENS equipment also gives us flexibility for quick changes between projects. We also have an experienced team of hand assemblers to complement the automatic equipment. Automated optical inspection (AOI) technology scrutinizes solder, polarity, and part number placement, ensuring that each product meets our quality standards.
HENGKAITUO also offers package on package (PoP) configurations, for increased component density, provides lead free wave solder or selective solder processing on pin-in-hole (PIH) systems, and handles both RoHS and non RoHS projects.
All of our PCB Assembly is to IPC standards 1, 2 or 3 and we can accommodate the majority of sizes and shapes of PCB. To ensure the assembly is free from any contaminants they are washed in an ultrasonic tank.
Many of the assemblies we produce require protective coatings. We can offer various varnishes and conformal coatings. We also offer potting / encapsulation using epoxies or polyurethane resins.
Our PCB Assembly capabilities include:
- Design for manufacturability/testability (DFM/DFT) recommendations
- Low to high volume SMT and TH mixed PCBAs
- Complex SMT including BGA and microBGA
- Prototype and pre-production electronic assembly
- Segregated RoHS and leaded production
- Conformal coating
- Functional, electrical and in-circuit testing