There were days when we used to use large electronic products. Any standard conventional printed circuit board (PCB) adequately sufficed the requirements. But gone are those days. With introduction of modern wearables, smartphones and even the Internet of Things, those conventional PCBs don’t work anymore. Rather there is an increasing requirement for smaller and thinner products. And PCB Manufacturing companies have responded gladly to this prevailing trend by making their products smaller and thinner as required by their clients.
We are presently living in an era of smartphones that are much thinner and lighter than their preceding counterparts. The functionalities of today’s mobile phones are undoubtedly superior to that of their predecessors. And this difference in functionality is the outcome of use of HDI PCB (High Density Interconnect PCB) that can easily accommodate more components in an even smaller place while offering notably enhanced functionalities.
Things that require sophisticated PCB Assembly
Today’s electronic devices and gadgets like wearable electronic equipment need multi-layer HDI PCB facilities with a number of components on the surface as well as within the PCB. To make it working, there is requirement for fine conductor widths with spaces between usually narrower than the conventional designs. Normal through-hole vias won’t fit into that space and thus fabricators need to resort blind and buried microvias drilled with laser treatments.
To comply with the requirements, PCB Manufacturing companies make more boards equipped with buried microvias to help increasing the number of interconnections available on the board and at the same time, freeing up more space on outer layer so that more number of components can be placed.
Another key aspect of sophisticated PCB Assembly is these PCBs are becoming even thinner. Improved fabricators use thinner cores and prepregs than they used to do for standard designs.